• Fortrend-YES have partnered to develop SIO-300-450 series of  High temperature, Air cooled, Controlled proces gas compositon, Laminar cross flow, Vertical vacuum oven - the result of many years experience in the design and manufacture of low particle and oxygen concentration 

              - Polyimide Cure
              - BCB cure
              - Photorsist Cure
              - Copper Anneal
              - Copper Oxide Removal
             
                    

• Up to 300mm capacity of wafer 50 each chamber 
• 200mm Wafer auto load available
• Continuoue horizental lamina flow of N2 
• Low O₂  < 10 ppm
• Process temperature range 150~450 °C
• Temperature uniformity better than ± 3.5  °C
• Maximum heating ramp 8°C/min, and cooling 6°C/min,It vary with chamber temperature 
• N2 pre-heating
• Exhaust condensate trap 

• System cleanness Class 1
• Oven cleanness Class 10
• Recipe: Programmable
• Process Cycle:Programmable