This robot arm is suitable for wafer transportation in waterproof environments, and can be equipped with vacuum suction or edge-grip mechanisms.
The protection rating is IP64, which means it is dust-tight and protected against water splashing from any direction. It can handle wafers in acidic, alkaline, and cleaning environments.
● Equipped with four Forks, which can be divided into dry and wet hands.
● Handling weight: Under 3 kg at the third joint of the arm.
● Wafer holding methods: Vacuum suction type/Clamping type.
● It features a four-arm structure, with independent motion for wafer transfer, to reduce wafer exchange time.
● The arm reach and track stroke can be customized according to the actual working conditions.
It is designed for high-speed transportation of semiconductor wafers in waterproof environments and is suitable for various semiconductor equipment related to wet processes, such as EFEMs and sorters. The lifting and horizontal movement strokes of the cleaning process equipment need to be customized according to space requirements.
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FWRD |
Z400 |
R190.5 |
Rta |
Ata |
F |
8 |
MRTX |
MOD |
F: Fortrend W: Wafer P: PLP substrate M: Mask C: Cassette H: Humid R: Robot D: Arm Qty. S: Single arm D: Dual-arm A*: X(X:Number of Arms)
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Axis-Z Height 240mm 300mm 400mm 500mm Z*XXX (Customized) LZ: Compact Lifting Height 240mm 300mm 400mm 500mm LZ*XXX(Customized) Dual-Z ZD600mm ZD700mm ZD800mm ZD*XXX (Customized) Module-based MZXXX |
Drive Arm R Length 146mm 190.5mm 213mm Eccentric ER (optional) |
Special Module Rta: Single arm FLiP Rta2: Double Arm Up FLIP Rta2: Double Arm Down FLIP RtaD: Double arm double FLip FR: wafer frame No Options |
End-effector Type Ata: Vacuum suction Cta: Edge gripper Han: Clamp lift type Ber1: Contact Bernoulli Ber2: Non-Contact Bernoulli Customer Customization |
Fork Type F: Original fork No Options |
Wafer Size 4″ / 6″ / 8″ / 12″ N*: Non-wafer object |
Matching Options M: M1: Opposite-shooting Mapping Quantity 1 M2: Opposite-shooting Mapping Quantity 2 M*: Mapping Quantity 1 No Options R: R: Original teach pendant No Options TX: T: Original Track axis X: TRACK axis effective distance/mm No Options |
Special Customization Have: Special Model None: Normal Device |
Vacuum Fork |
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Standard Vacuum Suction Y-Type |
Standard Vacuum Suction Linear Type |
U-shaped Vacuum Fork for Takio Plate |
Fork for Large Warping 1.5-5mm |
Multi-hole Vacuum Suction Fork |
Vacuum Suction & Friction Pad Fork |
Bernoulli Fork |
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Contact Bernoulli Circular Type |
Edge Contact Bernoulli |
Contact Bernoulli Y-shaped |
Edge Contactless Bernoulli |
Edge Clamping Non-contact Bernoulli |
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Wafer-holding Fork |
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Gripper Type Fork |
Gripper Rotating Type |
Compatible Fork |
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Frame-type Fork |
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Frame Gripping Fork |
Frame Clamping Fork |
Frame Vacuum Suction Fork |
Handling Items | 3" / 4" / 6" / 12" Wafers | |||
Movable Range (Arm Travel Distance) | Arm | Theta Rotation | Lifting | Track |
500mm |
340° |
Customized ≥500 | Customized | |
Transfer Speed (Average Speed) | 2000mm/s |
340° |
1000mm/s |
800~1500mm/s |
Arm Type | Quad Arm | |||
Repeatability | Within ±0.1mm | |||
Communication Protocol | HEX / ASCII / RJ45 | |||
Communication Method | EtherNet / RS232 | |||
Cleanliness | Maximum Class 1, with Independent Exhaust in Drive Structure | |||
Facility Requirements |
Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa |
SEMICONDUCTOR WAFER AUTOMATIC TRANSMISSION SYSTEM TOTAL SOLUTION
Upload time:Feb 14, 2025Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
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