● The Oven system has integrated mini-environment, 300mm load ports, wafer robot, cassette robot, and oven and control unit.
● Field proven application: 3DIC baking, photo-resist baking, moist removal, reflow and thermal process.
● 200mm cassette manual/auto load available.
● Wide operating range: ambient ~ 250 degrees.
● Full automatic.
● Friendly operational interface.
● Class 10 for Baking Chamber.
● Better Class 10 for Oven System
● Process Gas Input: N2, up to 3 gases
● Nitrogen Consumption: 10L/min
● Temperature Uniformity: ± 3.5℃
● Number of Recipe: Programmable
● Wafer bumping interlock
● Wafer and robotic arm protrusion detection
● Main controller: IPC
● OS: Windows XP professional
● Modular design minimizes adjustments, maintenance and downtime
● S2, S8 compliant
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