As advanced packaging technologies continue to evolve, handling larger and thinner substrates with high accuracy has become increasingly important. The PLP robot shown in this video is designed to meet these demands through stable, repeatable, and high-precision motion.

This handling test uses a dummy substrate to simulate real panel-level packaging conditions. By reproducing the size and movement requirements of actual production substrates, the test validates the robot’s ability to maintain precise positioning and smooth transport throughout the handling process.

The video demonstrates the PLP robot in motion during a large-substrate simulation. Even when transferring oversized panels, the robot maintains stable movement and accurate positioning, helping reduce the risk of vibration, misalignment, or substrate damage.

Key highlights include:

● Simulation of large-substrate handling conditions

● Validation of high-precision robot motion

● Smooth and stable transport throughout the transfer path

● Reliable positioning for advanced packaging processes

● Foundation for future panel-level packaging production systems

The test also confirms that the robot platform can support the increasingly demanding requirements of advanced packaging, where larger substrates and tighter tolerances are becoming standard.

By validating motion accuracy and transfer stability at an early stage, this PLP robot handling test lays the groundwork for future automation solutions in advanced packaging manufacturing.