The 300mm Frame Robot is specifically engineered for precise 300mm frame wafer handling applications. It delivers stable, high-accuracy automation designed for advanced semiconductor manufacturing environments.

With flexible integration capabilities, it seamlessly connects with EFEM systems and various process chambers, enabling smooth material transfer across different process modules.

This solution significantly enhances automation efficiency for large-size packaging and wafer-level processes, supporting higher throughput, improved consistency, and reduced manual intervention in modern production lines.