This FORTREND front - end automation module for PVD/CVD/ETCH process equipment docking features high cleanliness, modular design, and high efficiency.
It is equipped with components like a high - speed single - arm double - fork Robot and a wafer buffer mechanism to boost output.
It can be connected to the vacuum transfer chamber (VTM).
Its internal cleanliness can reach up to ISO Class 1.
It is compatible with all FOUP, FOSB, SMIF POD and Cassette that meet SEMI standards.
It has outstanding COO and COC, helping customers reduce costs and improve efficiency.
It also has customization capabilities and can be designed according to customer requirements.
Modular design for easy and quick installation and maintenance.
Many safety and anti - misoperation designs ensure normal equipment operation.
Services include installation, onsite training, global support, and various cost - effective long - term maintenance contracts.
Rated Voltage | Phase AC 220V 50/60 Hz |
Rated Power | 3.52kW(Decide by config) |
Comm Interface | RJ45 |
Comm protocol | ASCI/HEX/HSMS&SECS Ⅱ |
Software | Fortrend independently developed software |
Cleanliness | ISO 14644-1 class 1 / ISO class 3 |
Uptime | ≥99% |
MTBF | ≥4000 hours |
MTTR | ≤4 hours |
MTBA | >100 hours |
MTTA | <10 hours |
MCBF | 100,000Wafers |
Wafer Breakage Rate | ≤1/1,000,000 |
OCR Accuracy Rate for Bare Wafers | ≥99.9% |
Repeatability of Positioning Accuracy | 士0.1mm |
Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
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