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This FORTREND front - end automation module for PVD/CVD/ETCH process equipment docking features high cleanliness, modular design, and high efficiency.

It is equipped with components like a high - speed single - arm double - fork Robot and a wafer buffer mechanism to boost output.

It can be connected to the vacuum transfer chamber (VTM).

Its internal cleanliness can reach up to ISO Class 1.

It is compatible with all FOUP, FOSB, SMIF POD and Cassette that meet SEMI standards.

It has outstanding COO and COC, helping customers reduce costs and improve efficiency.

It also has customization capabilities and can be designed according to customer requirements.

With 45 years of semiconductor industry experience and validation, it complies with the SECS/GEM standard communication protocol for semiconductor factories.

Modular design for easy and quick installation and maintenance.

Many safety and anti - misoperation designs ensure normal equipment operation.

Services include installation, onsite training, global support, and various cost - effective long - term maintenance contracts.

CUSTOMIZED PLAN
Product Specifications
Rated VoltagePhase AC 220V 50/60 Hz
Rated Power3.52kW(Decide by config)
Comm InterfaceRJ45
Comm protocolASCI/HEX/HSMS&SECS Ⅱ
Software

Fortrend independently developed software

CleanlinessISO 14644-1 class 1 / ISO class 3
Uptime≥99%
MTBF4000 hours
MTTR≤4 hours
MTBA>100 hours
MTTA<10 hours
MCBF100,000Wafers
Wafer Breakage Rate1/1,000,000
OCR Accuracy Rate for Bare Wafers≥99.9%
Repeatability of Positioning Accuracy士0.1mm



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Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.

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