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This mechanical arm is designed for material handling in high-cleanliness environments.

It employs a closed-loop control system and is suitable for the transfer of MASK wafers and square glass plates.

Multi-Joint Wafer Transfer Robot

● Optional pseudo-horizontal multi-joint motion corresponding to parallel equipment layout.

● The EEF employs a closed-loop control system using a gripping mechanism.

● Carrying capacity: Below 3Kg at the third joint of the arm.

● Compatible with various types of Forks to meet the wafer transfer needs for different applications.

● Wafer holding methods: Clamping type, Lifting type.

● Based on the equipment layout, you can choose either an upper or lower fixing method.

APPLICATIONS

Suitable for working conditions with high requirements for cleanliness, precision, and reliability, ensuring the efficient and stable transfer of photomask (MASK) wafers in lithography processes. It is applicable to MASK EFEM and other MASK wafer transfer systems.

RANGE OF MOTION

Top Fixed Mode

Fix the counterbore and adjust the screw according to the configuration.

Bottom Fixed Mode

Fix the counterbore and adjust the screw according to the configuration.

Top fixed mode Bottom Fixed Mode

Single-Arm Robot Motion Range Schematic

Single-arm Robot Motion Range Schematic

Model

Z

R

MR*

A*

FWRS

300/400/500

146

8" 540

600

190.5

12" 610

680

*The arm length and minimum rotation radius may vary depending on the specific end effectors and drive shafts selected. The actual length should be based on the final product.

SELECTION RULES
ROBOT SELECTION RULES

FWRD

Z400

R190.5

Rta

Ata

F

8

MRTX

MOD

F: Fortrend

W: Wafer

P: PLP substrate

M: Mask

C: Cassette

H: Humid

R: Robot

D: Arm Qty.

S: Single arm

D: Dual-arm

A*: X(X:Number of Arms)

 

Axis-Z Height

240mm

300mm

400mm

500mm

Z*XXX (Customized)

LZ: Compact Lifting Height

240mm

300mm

400mm

500mm

LZ*XXXCustomized

Dual-Z

ZD600mm

ZD700mm

ZD800mm

ZD*XXX (Customized)

Module-based

MZXXX

Drive Arm R Length

146mm

190.5mm

213mm

Eccentric ER (optional)

Special Module

Rta: Single arm FLiP

Rta2: Double Arm Up FLIP

Rta2: Double Arm Down FLIP

RtaD: Double arm double FLip

FR: wafer frame

No Options

End-effector Type

Ata: Vacuum suction

Cta: Edge gripper

Han: Clamp lift type

Ber1: Contact Bernoulli

Ber2: Non-Contact Bernoulli

Customer Customization

Fork Type

F: Original fork

No Options

Wafer Size

4/ 6/ 8/ 12

N*: Non-wafer object

Matching Options

M:

M1: Opposite-shooting Mapping Quantity 1

M2: Opposite-shooting Mapping Quantity 2

M*: Mapping Quantity 1

No Options

R:

R: Original teach pendant

No Options

TX:

T: Original Track axis

X: TRACK axis effective distance/mm

No Options

Special Customization

Have: Special Model

None: Normal Device

ROBOT FORK SERIES

Vacuum Fork

Standard Vacuum Suction Y-TypeStandard Vacuum Suction Linear TypeU-shaped Vacuum Fork for Takio PlateFork for Large Warping 1.5-5mmMulti-hole Vacuum Suction ForkVacuum Suction & Friction Pad Fork

Standard Vacuum Suction Y-Type

Standard Vacuum Suction Linear Type

U-shaped Vacuum Fork for Takio Plate

Fork for Large Warping 1.5-5mm

Multi-hole Vacuum Suction Fork

Vacuum Suction & Friction Pad Fork

Bernoulli Fork

Contact Bernoulli Circular TypeEdge Contact BernoulliContact Bernoulli Y-shapedEdge Contactless BernoulliEdge Clamping Non-contact Bernoulli

Contact Bernoulli Circular Type

Edge Contact Bernoulli

Contact Bernoulli Y-shaped

Edge Contactless Bernoulli

Edge Clamping Non-contact Bernoulli


Wafer-holding Fork

Gripper Type ForkGripper Rotating TypeCompatible Fork


Gripper Type Fork

Gripper Rotating Type

Compatible Fork




Frame-type Fork

Frame Gripping ForkFrame Clamping ForkFrame Vacuum Suction Fork


Frame Gripping Fork

Frame Clamping Fork

Frame Vacuum Suction Fork




Product Specifications
Handling Items Mask Wafer/Square Glass Wafer
Movable Range (Arm Travel Distance)  Arm Theta Rotation Lifting

376mm

340°

240/300/400/500
Transfer Speed (Average Speed) 600mm/S

235°/S

250mm/S

Arm Type Single Arm
Handling Height 520-820mm
Repeatability Accuracy Within ±0.1mm
Communication Protocol HEX/ASCII
Communication Method EtherNet/RS232
Cleanliness Highest ISO Class 1
Facility Requirements Power: 220V, 10A
Vacuum: -70~-90Kpa
Positive Pressure: 0.1~0.5Mpa

CONTACT FORTREND
For urgent requests, please call the local office directly.
Product Recommendation
Video

Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.

Contact Us
408-734-9311sales@fortrend.com

2220 O’Toole Avenue, San Jose, CA 95131

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