This robotic arm is designed for material handling in high-cleanliness conditions, employing a closed-loop servo control system, and is suitable for high-speed transfer operations.
● Optional pseudo-horizontal multi-joint motion corresponding to parallel equipment layout.
● Adopting a single-arm construction, it can achieve high-speed transfer of wafers.
● Adopting a single Z-axis lifting structure, it is possible to achieve rapid lifting and lowering of the main body.
● Carrying capacity: Below 4Kg at the third joint of the arm.
● Capable of being paired with various types of custom forks to meet the transportation needs of different specifications of Cassette/reagent boxes.
● Fixed Method: Clamping Type.
● Fixed methods can be chosen either from the top or bottom based on the equipment layout.
Suitable for handling open cassettes, reagent boxes, and similar items in clean environments, with customization available based on specific usage conditions.
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FWRD |
Z400 |
R190.5 |
Rta |
Ata |
F |
8 |
MRTX |
MOD |
F: Fortrend W: Wafer P: PLP substrate M: Mask C: Cassette H: Humid R: Robot D: Arm Qty. S: Single arm D: Dual-arm A*: X(X:Number of Arms)
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Axis-Z Height 240mm 300mm 400mm 500mm Z*XXX (Customized) LZ: Compact Lifting Height 240mm 300mm 400mm 500mm LZ*XXX(Customized) Dual-Z ZD600mm ZD700mm ZD800mm ZD*XXX (Customized) Module-based MZXXX |
Drive Arm R Length 146mm 190.5mm 213mm Eccentric ER (optional) |
Special Module Rta: Single arm FLiP Rta2: Double Arm Up FLIP Rta2: Double Arm Down FLIP RtaD: Double arm double FLip FR: wafer frame No Options |
End-effector Type Ata: Vacuum suction Cta: Edge gripper Han: Clamp lift type Ber1: Contact Bernoulli Ber2: Non-Contact Bernoulli Customer Customization |
Fork Type F: Original fork No Options |
Wafer Size 4″ / 6″ / 8″ / 12″ N*: Non-wafer object |
Matching Options M: M1: Opposite-shooting Mapping Quantity 1 M2: Opposite-shooting Mapping Quantity 2 M*: Mapping Quantity 1 No Options R: R: Original teach pendant No Options TX: T: Original Track axis X: TRACK axis effective distance/mm No Options |
Special Customization Have: Special Model None: Normal Device |
Vacuum Fork |
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Standard Vacuum Suction Y-Type |
Standard Vacuum Suction Linear Type |
U-shaped Vacuum Fork for Takio Plate |
Fork for Large Warping 1.5-5mm |
Multi-hole Vacuum Suction Fork |
Vacuum Suction & Friction Pad Fork |
Bernoulli Fork |
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Contact Bernoulli Circular Type |
Edge Contact Bernoulli |
Contact Bernoulli Y-shaped |
Edge Contactless Bernoulli |
Edge Clamping Non-contact Bernoulli |
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Wafer-holding Fork |
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Gripper Type Fork |
Gripper Rotating Type |
Compatible Fork |
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Frame-type Fork |
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Frame Gripping Fork |
Frame Clamping Fork |
Frame Vacuum Suction Fork |
Handling Items | 3/4/6/8/Cassette/Suitable Size Reagent Box | ||
Movable Range (Arm Travel Distance) | Arm | Theta Rotation | Lifting: |
290/376mm |
340° |
300/400/500 | |
Transfer Speed (Average Speed) | 750mm/S |
235°/S |
500mm/S |
Arm Type | Single Arm | ||
Handling Height | Configuration dependent | ||
Repeatability Accuracy | Within ±0.1mm | ||
Communication Protocol | HEX/ASCII | ||
Communication Method | EtherNet/RS232 | ||
Cleanliness | Highest ISO Class 1 | ||
Facility Requirements |
Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa |
SEMICONDUCTOR WAFER AUTOMATIC TRANSMISSION SYSTEM TOTAL SOLUTION
Upload time:Feb 14, 2025Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.
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