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This mechanical arm is designed for material handling in high-cleanliness environments. It employs a closed-loop control system and is suitable for the transportation of PLP glass substrates.

The PLP robot is designed for the FO-PLP (Fan-Out Panel Level Package) process, mainly used for the handling of glass substrates with a size of 515*510mm, maximum handling size of 600*600mm.

● Optional pseudo-horizontal multi-joint motion corresponding to parallel equipment layout.

● Carrying weight: up to 4Kg.

● Capable of being paired with different types of Forks to meet various wafer transfer requirements.

● Fixed methods can be chosen either from the top or bottom based on the equipment layout.

● The transmission is efficient and stable, with high cleanliness.

● The control method uses closed-loop servo control, ensuring the efficiency and yield of products in the packaging process.


APPLICATIONS

High-cleanliness, space-constrained glass substrate PLP EFEM and similar equipment.

RANGE OF MOTION

Top Fixed Mode

Fix the counterbore and adjust the screw according to the configuration.

Bottom Fixed Mode

Fix the counterbore and adjust the screw according to the configuration.

Top fixed mode Bottom fixed mode

Schematic Diagram of the Motion Range for A Dual-Arm Robotic Arm

Schematic diagram of the motion range for a dual-arm robotic arm

*The arm length and minimum rotation radius may vary depending on the specific end effectors and drive shafts selected. The actual length should be based on the final product.

SELECTION RULES
ROBOT SELECTION RULES

FWRD

Z400

R190.5

Rta

Ata

F

8

MRTX

MOD

F: Fortrend

W: Wafer

P: PLP substrate

M: Mask

C: Cassette

H: Humid

R: Robot

D: Arm Qty.

S: Single arm

D: Dual-arm

A*: X(X:Number of Arms)

 

Axis-Z Height

240mm

300mm

400mm

500mm

Z*XXX (Customized)

LZ: Compact Lifting Height

240mm

300mm

400mm

500mm

LZ*XXXCustomized

Dual-Z

ZD600mm

ZD700mm

ZD800mm

ZD*XXX (Customized)

Module-based

MZXXX

Drive Arm R Length

146mm

190.5mm

213mm

Eccentric ER (optional)

Special Module

Rta: Single arm FLiP

Rta2: Double Arm Up FLIP

Rta2: Double Arm Down FLIP

RtaD: Double arm double FLip

FR: wafer frame

No Options

End-effector Type

Ata: Vacuum suction

Cta: Edge gripper

Han: Clamp lift type

Ber1: Contact Bernoulli

Ber2: Non-Contact Bernoulli

Customer Customization

Fork Type

F: Original fork

No Options

Wafer Size

4/ 6/ 8/ 12

N*: Non-wafer object

Matching Options

M:

M1: Opposite-shooting Mapping Quantity 1

M2: Opposite-shooting Mapping Quantity 2

M*: Mapping Quantity 1

No Options

R:

R: Original teach pendant

No Options

TX:

T: Original Track axis

X: TRACK axis effective distance/mm

No Options

Special Customization

Have: Special Model

None: Normal Device

ROBOT FORK SERIES

Vacuum Fork

Standard Vacuum Suction Y-Type Standard Vacuum Suction Linear Type U-shaped Vacuum Fork for Takio Plate Fork for Large Warping 1.5-5mm Multi-hole Vacuum Suction Fork Vacuum Suction & Friction Pad Fork

Standard Vacuum Suction Y-Type

Standard Vacuum Suction Linear Type

U-shaped Vacuum Fork for Takio Plate

Fork for Large Warping 1.5-5mm

Multi-hole Vacuum Suction Fork

Vacuum Suction & Friction Pad Fork

Bernoulli Fork

Contact Bernoulli Circular Type Edge Contact Bernoulli Contact Bernoulli Y-shaped Edge Contactless Bernoulli Edge Clamping Non-contact Bernoulli

Contact Bernoulli Circular Type

Edge Contact Bernoulli

Contact Bernoulli Y-shaped

Edge Contactless Bernoulli

Edge Clamping Non-contact Bernoulli

Wafer-holding Fork

Gripper Type Fork Gripper Rotating Type Compatible Fork

Gripper Type Fork

Gripper Rotating Type

Compatible Fork

Frame-type Fork

Frame Gripping Fork Frame Clamping Fork Frame Vacuum Suction Fork

Frame Gripping Fork

Frame Clamping Fork

Frame Vacuum Suction Fork

Product Specifications
Handling Items 515*510mm Glass Substrate
Movable Range (Arm Travel Distance)  Arm Theta Rotation Lifting:

376/500/760mm

340°

Z300/ZD500/ZD700
Transfer Speed (Average Speed) 550mm/S

200°/S

300mm/S

Arm Type Dual Arms
Handling Height 890mm 
Repeatability Accuracy Within ±0.2mm
Communication Protocol HEX/ASCII
Communication Method EtherNet/RS232
Cleanliness Highest ISO Class 1
Facility Requirements Power: 220V, 10A
Vacuum: -70~-90Kpa
Positive Pressure: 0.1~0.5Mpa

CONTACT FORTREND
For urgent requests, please call the local office directly.
Product Recommendation
Video

Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.

Contact Us
408-734-9311sales@fortrend.com

2220 O’Toole Avenue, San Jose, CA 95131

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