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This mechanical arm is designed for material handling in high-cleanliness environments. It employs a closed-loop control system and is suitable for the transportation of PLP glass substrates.
The PLP robot is designed for the FO-PLP (Fan-Out Panel Level Package) process, mainly used for the handling of glass substrates with a size of 515*10mm, maximum handling size of 600*600mm, and the maximum handling weight up to 4Kg. The transmission is efficient and stable, with high cleanliness. The control method uses closed-loop servo control, ensuring the efficiency and yield of products in the packaging process.
SELECTION RULES
Product Specifications
Handling Items 515*510mm Glass Substrate
Movable Range (Arm Travel Distance)  Arm Theta Rotation Lifting:

376/500/760mm

340°

Z300/ZD500/ZD700
Transfer Speed (Average Speed) 550mm/S

200°/S

300mm/S

Arm Type Dual Arms
Handling Height 890mm 
Repeatability Accuracy Within ±0.2mm
Communication Protocol HEX/ASCII
Communication Method EtherNet/RS232
Cleanliness Highest ISO Class 1
Facility Requirements Power: 220V, 10A
Vacuum: -70~-90Kpa
Positive Pressure: 0.1~0.5Mpa

CONTACT FORTREND
For urgent requests, please call the local office directly.
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Disclaimer: The appearance, specifications, performance descriptions, comparative data, and other information regarding the products displayed on this website are based on internal testing and experiments conducted in FORTREND’s laboratory. This information is for reference purposes only, and the final product may vary.

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