3-Axis Humid Single-arm Robot Manipulator-FORTREND

This robotic arm is suitable for wafer transfer in waterproof environments and can be used in conjunction with a wafer flipper and edge grip mechanism.

It has a protection level of IP64 and is capable of handling wafers in acidic, alkaline, and cleaning environments.

● Optional pseudo-horizontal multi-joint motion corresponding to parallel equipment layout.

● Carrying capacity: Below 3Kg at the third joint of the arm.

● The arm section is coated with Teflon to ensure corrosion resistance.

● O-ring seals are used at component joint interfaces.

● The waterproof structure of the Z-axis utilizes an accordion-style bellows.

● Wafer fixing methods: Vacuum suction type / Clamping type.

APPLICATIONS

Suitable for various semiconductor equipment, including EFEM, Sorter, inspection equipment, etc.

RANGE OF MOTION

Top Fixed Mode Fix the counterbore and adjust the screw according to the configuration.	Bottom Fixed Mode Fix the counterbore and adjust the screw according to the configuration.

Single-Arm Robot Motion Range Schematic

Model	Z	R	MR*	A*
FWRS	300/400/500	146	8" 540	600
FWRS	300/400/500	190.5	12" 610	680

*The arm length and minimum rotation radius may vary depending on the specific end effectors and drive shafts selected. The actual length should be based on the final product.

SELECTION RULES

FWRD

Z400

R190.5

Rta

Ata

F

8

MRTX

MOD

F: Fortrend

W: Wafer

P: PLP substrate

M: Mask

C: Cassette

H: Humid

R: Robot

D: Arm Qty.

S: Single arm

D: Dual-arm

A*: X(X:Number of Arms)

Axis-Z Height

240mm

300mm

400mm

500mm

Z*XXX (Customized)

LZ: Compact Lifting Height

240mm

300mm

400mm

500mm

LZ*XXX（Customized）

Dual-Z

ZD600mm

ZD700mm

ZD800mm

ZD*XXX (Customized)

Module-based

MZXXX

Drive Arm R Length

146mm

190.5mm

213mm

Eccentric ER (optional)

Special Module

Rta: Single arm FLiP

Rta2: Double Arm Up FLIP

Rta2: Double Arm Down FLIP

RtaD: Double arm double FLip

FR: wafer frame

No Options

End-effector Type

Ata: Vacuum suction

Cta: Edge gripper

Han: Clamp lift type

Ber1: Contact Bernoulli

Ber2: Non-Contact Bernoulli

Customer Customization

Fork Type

F: Original fork

No Options

Wafer Size

4″ / 6″ / 8″ / 12″

N*: Non-wafer object

Matching Options

M:

M1: Opposite-shooting Mapping Quantity 1

M2: Opposite-shooting Mapping Quantity 2

M*: Mapping Quantity 1

No Options

R:

R: Original teach pendant

No Options

TX:

T: Original Track axis

X: TRACK axis effective distance/mm

No Options

Special Customization

Have: Special Model

None: Normal Device

ROBOT FORK SERIES

Vacuum Fork

Standard Vacuum Suction Y-Type	Standard Vacuum Suction Linear Type	U-shaped Vacuum Fork for Takio Plate	Fork for Large Warping 1.5-5mm	Multi-hole Vacuum Suction Fork	Vacuum Suction & Friction Pad Fork
Bernoulli Fork

Contact Bernoulli Circular Type	Edge Contact Bernoulli	Contact Bernoulli Y-shaped	Edge Contactless Bernoulli	Edge Clamping Non-contact Bernoulli
Wafer-holding Fork

Gripper Type Fork	Gripper Rotating Type	Compatible Fork
Frame-type Fork

Frame Gripping Fork	Frame Clamping Fork	Frame Vacuum Suction Fork

Product Specifications

Handling Items	3 / 4 / 6 / 8 /12 inch wafers
Movable Range (Arm Travel Distance)	Arm	Theta Rotation	Lifting
	290/376mm	340°	300/400/500
Transfer Speed （Average Speed）	750mm/S	235°/S	500mm/S
Arm Type	Single Arm
Handling Height	780--980mm
Repeatability Accuracy	Within ±0.1mm
Communication Protocol	HEX / ASCII
Communication Method	EtherNet / RS232
Cleanliness	Highest ISO Class 1
Facility Requirements	Power: 220V, 10A Vacuum: -70~-90Kpa Positive Pressure: 0.1~0.5Mpa

APPLICATIONS

Top Fixed Mode

Bottom Fixed Mode

Vacuum Fork

Bernoulli Fork

Wafer-holding Fork

Frame-type Fork